The Senior Integration Engineer for RF-GaN Device will be part of the R&D team and play a pivotal role in our GaN foundry team. SPARC Foundry’s RF-GaN Product Line is looking for engineers with industry-relevant experience in developing high-performing Gallium Nitride (GaN) device technologies for high-frequency applications, and to drive innovative fab-based technology development for leading-edge, high-power solutions (>500W) in Vigo, Spain.
As a Senior Process Integration Engineer, you will become a core member of a broader center of excellence in Wide Bandgap (WBG) technology development, driving innovation across technology platforms and bridging the gap between semiconductor processing and circuit performance. Engineers with a MSc or Ph.D. degree and over 8 years of industry-relevant R&D experience in Gallium Nitride technology are strongly preferred.
Essential Responsibilities
This position offers the unique opportunity to develop innovative RF Discrete & MMIC GaN technologies as a Senior Process Integration Engineer and deliver performance and reliability demonstration across technology development qualification milestones from conception through manufacturing installation.
Primary Responsibilities:
Develop & Qualify innovative process sequences and device structures (such as GaN HEMTs or GaN MISHEMTs) that meet our customer's performance, high-power thermal management, reliability, yield, and cost objectives eg. for applications exceeding 500W.
Technical Lead of Technology Transfer Programs: Drive the successful transfer of new GaN technology nodes from R&D phases into high-volume manufacturing, ensuring seamless fab integration.
Optimize Key Fabrication Processes: Collaborate with Fab process-engineers to develop, sustain, and improve critical cleanroom processes, including dry/wet etching, thin-film deposition (CVD, PVD), and Atomic Layer Deposition (ALD).
Contribute to complex, technical projects critical to technology development and fab process qualification goals.
Execute DOE (Design of Experiments) definition, planning, execution, and data-driven analysis of results to achieve device performance and wafer manufacturing targets.
Expanded Responsibilities:
Collaborate actively within cross-functional teams to support innovation, interfacing seamlessly with various engineering groups—including RF design, small & large signal characterization, model verification, failure analysis, unit process module, reliability, manufacturing, and research organizations—to contribute to overall program success.
